OE-A presented "Printed Electronics - Chances and Challenges: The OE-A Roadmap" at the 6th Chinese Flexible and Printed Electronics Symposium, on 24-25 October in Changzou, China.
Organized by Changzhou institute of Printed Electronics Industry (CZIPEI), the 6th Flexible and Printed Electronic China (6th FPE China) and the 1st Printed Electronics Industry Summit have taken place in Changzhou, China from October 24-25, 2016. The mission of FPE China 2016 is to accelerate the commercialization and adoption of Printed Electronics Technology both in China and worldwide. The event of this year dedicated symposia and forums, which attracted over 240 international attendees, focused mainly on the following three aspects:
- Technology of Printed Electronics including organic & inorganic thin-film transistor, OPV, printed flexible display, printed sensor, printed memory, printed logic etc.;
- System of printed electronics including the integration and manufacture;
- Commercial application of printed electronics.
For more information, visit www.fpechina.org
OE-A presented "Printed Electronics - Chances and Challenges: The OE-A Roadmap"
Dr Klaus Hecker, OE-A Managing Director, presented "Printed Electronics - Chances and Challenges: The OE-A Roadmap" during the FPE. Representing the organic and printed electronics industry, the OE-A used this great opportunity for expanding OE-A's network as well as to introduce the numerous benefits and application possibilities of this emerging technology to the Chinese community.
Affiliated to the conference, the first printed electronic industry round-table discussion, as a part of the summit, was held on October 23. The round-table discussion was focused on printed and flexible electronics commercialization challenges, needs, and supply chain development. Director Wang WW from the Ministry of Information Technology has participated in the discussion and pointed out the importance of the new technology industrialization and government policy support. He has emphasized that in the next 10 years, the Chinese central government is leading economic reforms from a labor intense industry to a technology infused industry development. It provides great opportunities for technology-rich printed electronics commercialization in many applications, e.g. large area flexible electronics/optoelectronics, supply chain/cold chain management, and anti-counterfeiting. The participants in both the round-table discussion and the conference were world and domestic leaders in printed and flexible electronics community. The OEA gave comprehensive overviews of the printed electronics market as well as its OE-A roadmap, while CZIPEI and PERC introduced PE commercialization and R&D activities in China.
Opening of Printed Electronics Industry Park
One highlight of the meeting is that CZIPEI announced that the first Printed Electronics Industry Park is opening to the public on May 2017 at Changzhou, China. The PE Industry Park is operated by CZIPEI with six PE industrialization platforms, namely PE technology incubation, scale-up process and manufacturing facility, central test lab, public service platform, standardization, and PE exhibition and education center.
For more information, visit www.czipei.com