Packaging pitches: Smart, smarter, printed electronics

10.04.2017 | id:446617

Visit OE-A’s exhibition stand and attend expert’s presentations at interpack 2017 in Düsseldorf, Germany

On May 04-10, the OE-A will exhibit at VDMA’s Food Processing and Packaging Machinery Association exhibition booth (Hall 5 / J38) at interpack 2017. Showcased are innovative smart packaging products and demonstrators in which organic and printed electronics have been applied.

Lightning talks by OE-A experts
At the OE-A stand several short presentations will be given about how printed electronics enables smart packaging. With as key theme “Packaging pitches: Smart, smarter, printed electronics”, OE-A members – the experts of the industry – will discuss the countless application possibilities of printed electronics in the packaging industry.
The use of organic and printed electronics in packaging opens up new ways of how we use and transmit information and data along the entire value chain, from logistics and operations to marketing, sales, and service. It can play an important role in reducing food waste, encourage potential buyers to purchase the product, and interactively inform or instruct consumers about its content. Active packaging and labels with integrated electronics can indicate, for example, the current quality of the food, the temperature logging, provide medication instructions or serve as a cross-media instrument. Due to their ultra-thin, free form, and lightweight features, organic and printed electronics make an excellent and economic choice for the creation of active packaging.

Program

Thursday, May 04

  • 14:00h    Smart Packaging enabled by Printed Electronics – An Introduction, Dr. Klaus Hecker, Managing Director, OE-A
  • 14:10h    Interact - Printed electronics enables interactive packaging, Wolfgang Mildner, CEO, MSWtech
  • 14:25h    OLED, the smart revolution: Printed light in packaging, recycable, compostable… and simply lasting impressive!, Martin Glatz, Vice President Sales, Marketing, Research and Development, Karl Knauer

Friday, May 05

  • 14:00h    Smart Packaging enabled by Printed Electronics – An Introduction, Dr. Klaus Hecker, Managing Director, OE-A
  • 14:10h    Smart Labeling enabling Smart Packaging, Sebastian Gepp, Technology Manager, Schreiner Group
  • 14:25h    From the IoT to the IoE (Internet of Things to Internet of Everything), Eric Vanroyen, Director Business Development EMEA, Thin Film Electronics ASA

Monday, May 08

  • 14:00h    Smart Packaging enabled by Printed Electronics – An Introduction, Dr. Constanze Ranfeld, Project Manager, OE-A
  • 14:10h    Scaling up building blocks of active and intelligent packaging, Riku Rikkola, Business Development Manager, VTT – Technical Research Centre of Finland
  • 14:25h    Printable Electronics for Smart Packaging, Dr. Simon Johnson, Electronics Engineering Manager Printable Electronics, The Centre for Process Innovation (CPI)

Tuesday, May 09

  • 14:00h    Smart Packaging enabled by Printed Electronics – An Introduction, Dr. Constanze Ranfeld, Project Manager, OE-A
  • 14:10h    Printed Electronics integrated into Smart Packages, Dr. Andreas Willert, Senior Scientist, Fraunhofer ENAS
  • 14:25h    PiScale: European pilot line for flexible OLEDs, Pavel Kudlacek, Project Manager, Holst Centre / TNO

 


interpack in a nutshell
interpack is the process and packaging leading trade fair, representing the entire value creation chains: From the production and refinement of packaging products and packaging materials - over packaging and distribution - right up to quality assurance and consumer protection. The packaging industry is essential to all other industry sectors. All industry sectors require intelligent packaging strategies along the entire value chain, encompassing warehousing, logistics and even administration. The event for the packaging industry takes place every three year in Düsseldorf, Germany.
More about interpack


For more information, please contact daria.firlus@oe-a.org

Verstraelen, Sophie Isabel
Verstraelen, Sophie Isabel