OE-A members will meet in Cambridge, UK to focus on sensor applications enabled by Printed Electronics
20.07.2017 | id:487936
During the 41st OE-A Working Group Meeting on October 10-11, printed electronics experts will gather for interactive discussions and international networking.
On October 10-11, 2017, the 41st OE-A Working Group Meeting will take place in Cambridge, UK and will be hosted by OE-A member CDT. With as special topic “Sensor applications enabled by Printed Electronics” there will be various presentations by printed electronics end-users and experts. In addition, the OE-A will report on its latest and upcoming activities, Working Groups will meet to assess their progress, as well as interactive discussions and the exchange of ideas are planned.
In the evening of the first day, there will be a networking dinner in Sussex College which allows OE-A members and guests to deepen their discussions on printed electronics in a historical setting.
A company tour will conclude this Working Group Meeting on Wednesday. As a special event, OE-A, along with CDT and EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge will be hosting a networking reception after the company tour, for both OE-A members as well as attendees of Printed Electronics Insights (see below). We are happy to announce Professor Sir Richard Friend as dinner speaker.
Creating the right partnerships is essential, both between different companies as well as between companies and research institutes. With regular Working Group Meetings in Europe, Asia and the US, OE-A supports its members with an effective networking and communication platform, fostering collaboration and promoting information exchange among all players along the value chain.
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Printed Electronics Insights: Smart Packaging & IoT
On Thursday, October 12 – following the OE-A Working Group Meeting – the OE-A is, together with EPSRC / University of Cambridge, organizing “Printed Electronics Insights: Smart Packaging & IoT”. The day will be filled with presentations and a panel discussion by renown experts, co-sponsored by FlexTech.