Printed Electronics Insights: Smart Packaging & IoT

20.07.2017 | id:487950

Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK).

Together with EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge, OE-A is organizing “Printed Electronics Insights: Smart Packaging & IoT”, a day of presentations and a panel discussion, co-sponsored by FlexTech. The event will be held on Thursday, October 12, 2017 at Robinson College, Cambridge (UK), with company tours and a networking reception on the day before during the 41th OE-A Working Group Meeting (Oct. 11, 2017).

Inspired by a keynote on machine learning by Christopher Williams, Chief Architect for IBM Watson Europe, attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.
 
We are proud to have won Professor Sir Richard Friend, FRS, FREng, as dinner speaker at the networking reception on October 11. Furthermore, you can expect presentations by various renown experts from international companies and research institutes such as PragmatIC, Arjowiggins, VTT and CDT. The finalized program will be available soon.
 
Registration
Registration will be handled via EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge. OE-A members will receive a discount of 60% on ticket prices. 
 
Ticket prices:
  • £250 
  • £100 (OE-A members, FlexTech members)
 
For questions, please contact daria.firlus@oe-a.org
 
Verstraelen, Sophie Isabel
Verstraelen, Sophie Isabel