Printed Electronics Insights: Smart Packaging & IoT
20.07.2017 | id:487950
Attend a day full of presentations and discussions by experts in the field of printed electronics on October 12, in Cambridge (UK).
Inspired by a keynote on machine learning by Christopher Williams, Chief Architect for IBM Watson Europe, attendees will learn more on IoT and its application in Smart Packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.
We are proud to have won Professor Sir Richard Friend, FRS, FREng, as dinner speaker at the networking reception on October 11. Furthermore, you can expect presentations by various renown experts from international companies and research institutes such as PragmatIC, Arjowiggins, VTT and CDT. The finalized program will be available soon.
Registration will be handled via EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge. OE-A members will receive a discount of 60% on ticket prices.
For questions, please contact firstname.lastname@example.org