OE-A represents the Printed Electronics industry at ICFPE 2017

20.07.2017 | id:488281

Special session on “New Technologies and Applications for Printed Electronics”, Jeju Island, South Korea
The International Conference on Flexible and Printed Electronics (ICFPE) 2017 will take place on September 5-7, 2017 at Jeju Island, South Korea. 

Adding to the general sessions based on the broad topics of flexible/printed electronics are more than 15 special sessions, which focus on more specific subjects including manufacturing challenges, emerging products, and flexible/printed electronics outlook. The special sessions, organized by global-leading FPE companies and research institutes will offer an exciting, panoramic view on the R&D frontline of flexible/printed electronics.
OE-A’s session “New Technologies and Applications for Printed Electronics” takes place on Wednesday, September 6 and consists out of the following topics presented by OE-A members:
  • OE-A Roadmap for Organic and Printed Electronics
    Andreas Willert, Senior Scientist, Fraunhofer ENAS
  • Merging design and function: Advancing PE capabilities through new inkjet ink formulations and photonic curing
    Stan Farnsworth, Chief Marketing Officer, NovaCentrix
  • Recent progress in R2R manufacturing of large area printed electronics
    Dr. Martin Busch, Business Development Manager, Coatema
  • An introduction to CPIs National Printable Electronics Centre -Hybrid Electronics- realising the Internet of Things (IOT)
    Dr. Mike Clausen, Site Operations Manager, CPI UK

For more information, please contact daria.firlus@oe-a.org 

The annual conference highlights challenges, emerging processes and applications in printing process, materials and devices. It will cover a broad range of topics in this field and focus on novel processes, novel materials and devices, enabled or constrained particularly by the nature of printing processing.
The ICFPE 2017 will underpin the need for collaboration and cooperation of individuals from a wide range of professional backgrounds. This rich program will also provide all attendees with the opportunities to meet and interact with the leading scientists, researchers and colleagues as well as sponsors.