At electronica, LOPEC and OE-A present the current state of printed electronics
When pharmaceutical packages sound an alarm or food cartons measure the temperature, printed electronics are involved. LOPEC will provide information about next generation packaging from March 19 to 21, 2019.
Present your current business models, innovative developments or research results at the LOPEC Conference 2019 – the world’s leading communication platform for organic and printed electronics - March 19-21, 2019 in Munich, Germany.
From OLEDs to intelligent packaging: From March 13 to 15, LOPEC in Munich (Germany) showcased groundbreaking developments in flexible electronics.
Fascinating new developments from the world of printed electronics, the technology’s possibilities in the healthcare sector, or experiencing the production process of NFC-powered LEDs: this is just a small excerpt from the diverse supporting program of LOPEC 2018.
In addition to new printing materials and machines, exhibitors from all over the world will showcase numerous prototypes and commercial products with printed electronic components.
Workshop on connecting printed electronics and the aviation industry on December 10-11 in Hamburg, Germany
FPE Journal from IOP Publishing is now the official academic journal endorsed by the OE-A
For OE-A members the growth trend of this international industry remains stable
Visit the joint pavilion and attend the OE-A conference track on January 9-12, 2019 in Las Vegas, USA
OE-A exhibition and sessions in Munich, Germany at November 13-16
A guiding document for the TOLAE industry on regulations, directives and standards
Attend OE-A Meeting in Aix en Provence, France on October 23-24
Special session on “New Applications of Flexible and Printed Electronics”, Changzhou, China
Revolutionizing Industry 4.0 through printed electronics