News & Media
Smart packaging enabled by printed electronics
12/05/17 OE-A’s expert presentations and exhibition at interpack 2017 in Düsseldorf, Germany well received
Students enthusiastic about Printed Electronics Hands-on Workshop
01/05/17 OE-A and University of Applied Sciences Munich organized several lectures and practical sessions on printing and characterizing organic electronic devices
Packaging pitches: Smart, smarter, printed electronics
10/04/17 Visit OE-A’s exhibition stand and attend expert’s presentations at interpack 2017 in Düsseldorf, Germany
Printed electronics at productronica 2017: LOPEC and OE-A present new insights on the latest technology
07/11/17 The possibilities opened up by printed electronics for electronic manufacturers will be a topic at the Innovation Forum of productronica, the world’s leading trade fair for electronics development and production.
LOPEC 2018 - Call for Papers
06/09/17 Present your latest research results, business models, developments, or products at LOPEC Conference 2018
LOPEC 2018: 3D-printed circuits and more
04/10/17 Printed electronics and 3D-printing systems are coming together and enabling new applications. The current state of this technology and its potential are a hot topic at LOPEC 2018, March 13 -15.
OE-A in the media